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NLAS4717 4.5 W High Bandwidth, Dual SPDT Analog Switch
The NLAS4717 is an advanced CMOS analog switch fabricated in sub-micron silicon gate CMOS technology. The device is a dual independent Single Pole Double Throw (SPDT) switch featuring two low RDS(on) of 4.5 W at 3.0 V. The device also features guaranteed Break-Before-Make (BBM) switching, assuring the switches never short the driver. The NLAS4717 is available in two small size packages: Micro10: 3.0 x 5.0 mm Flip-Chip-10: 2.0 x 1.5 mm
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MARKING DIAGRAMS
* * * * * * * * * * * * * *
Low RDS(on): 4.5 W @ 3.0 V Matching Between the Switches 0.5 W Wide Low Voltage Range: 1.8 V to 5.5 V High Bandwidth > 40 MHz 1.65 V to 5.5 V Operating Range Low Threshold Voltages on Pins 4 and 8 (CTRL Pins) Ultra-Low Charge Injection 6.0 pC Low Standby Current - ICC = 1.0 nA (Max) @ TA = 25C OVT* on Pins 4 and 8 (CTRL Logic Pins) Pb-Free Packages are Available
A1 FLIP-CHIP-10 CASE 489AA A1 10
4717 AYWW G G
Micro10 CASE 846B A Y W, WW G
4717 AYW G G 1 = Assembly Location = Year = Work Week = Pb-Free Package
Typical Applications
Cell Phones PDAs MP3s Digital Still Cameras
FUNCTION TABLE
IN_ 0 1 NO_ OFF ON NC_ ON OFF
Important Information
* ESD Protection: * *
HBM = 2000 V, MM = 200 V Latchup Max Rating: 200 mA (Per JEDEC EIA/JESD78) Pin-to-Pin Compatible with MAX4717
ORDERING INFORMATION
Device NLAS4717FCT1 Package Flip-Chip-10 Shipping 3000 / Tape & Reel 3000 / Tape & Reel 4000 / Tape & Reel 4000 / Tape & Reel
*OVT
* Overvoltage Tolerance (OVT) specific pins to operate higher than
normal supply voltages, with no damage to the devices or to signal integrity.
NLAS4717FCT1G Flip-Chip-10 (Pb-Free) NLAS4717MR2 Micro10
NLAS4717MR2G
Micro10 (Pb-Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2006
1
April, 2006 - Rev. 8
Publication Order Number: NLAS4717/D
NLAS4717
GND VCC NO1 COM1 IN1 NC1 1 2 3 4 5 Micro10 (Top View) 10 9 8 7 6 NO2 COM2 IN1 IN2 COM1 NC2 NO1 GND C4 B4 VCC Flip-Chip-10 (Top View) A4 NO2 C3 A3 COM2 C2 A2 IN2 B1 NC1 C1 A1 NC2
Figure 1. Device Circuit Diagrams and Pin Configurations MAXIMUM RATINGS
Symbol V+ VIS VIN IIK IPK Positive DC Supply Voltage Analog Input Voltage (VNO, VNC, or VCOM) (Note 1) Digital Select Input Voltage DC Current, Into or Out of Any Pin (Continuous) Peak Current (10% Duty Cycle) Parameter Value *0.5 to )7.0 *0.5 v VIS v VCC )0.5 *0.5 v VI v)7.0 $100 $200 Unit V V V mA mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Signal voltage on NC, NO, and COM exceeding VCC or GND are clamped by the internal diodes. Limit forward diode current to maximum current rating.
RECOMMENDED OPERATING CONDITIONS
Symbol V+ VIN VIS TA tr, tf DC Supply Voltage Digital Select Input Voltage Analog Input Voltage (NC, NO, COM) Operating Temperature Range Input Rise or Fall Time, SELECT VCC = 3.3 V $ 0.3 V VCC = 5.0 V $ 0.5 V Parameter Min 1.8 GND GND -40 0 0 Max 5.5 5.5 VCC +85 100 20 Unit V V V C ns/V
ANALOG SWITCH DC CHARACTERISTICS
-40C to +85C Symbol VIH Parameter Input Logic High Voltage Condition VOUT = 0.1 V IOUT 20 mA VIL Input Logic Low Voltage VOUT = -VCC - 0.1 V IOUT 20 mA IIN VCC ICC Input Leakage Current Power Supply Range Supply Current VIN - VCC or GND All VIN = VCC or GND IOUT = 0 mA VIS Analog Signal Range Key parameter VCC (V) 1.65 to 2.2 2.7 to 3.6 4.5 to 5.5 1.65 to 2.2 2.7 to 3.6 4.5 to 5.5 5.0 - 1.8 3.3 5.0 - Min VCC x 0.55 VCC x 0.5 2.0 - - - -100 1.65 - - - 0 Max - - - VCC x 0.2 VCC x 0.2 0.8 +100 5.5 1.0 1.0 1.0 VCC V nA V mA V Unit V
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NLAS4717
ANALOG SWITCH CHARACTERISTICS - Digital Section (Voltages Referenced to GND)
-40C to +85C Symbol RON Parameter ON Resistance (Note 2) Condition VCC = 3.0 V ICOM = 10 mA VNO or VNC = VIH or VIL VCC = 5.0 V ICOM = 10 mA VNO or VNC = VIH or VIL DRON ON Resistance Match Between Channels (Note 2 and 3) VCC = 3.6 V ICOM = 10 mA VNO or VNC = VIH or VIL VCC = 5.5 V ICOM = 10 mA VNO or VNC = VIH or VIL RFLAT[ON] ON Resistance Flatness (Note 4) ICOM = 10 mA VIS = 0 to VCC ICOM = 10 mA VIS = 0 to VCC INO_[OFF] INC_[OFF] NO_, NC_ Off-Leakage Current (Note 5) VCC = 3.6 V VCOM = 0.3 V or 3.3 V VNO or VNC = 0.3 V or 3.3 V VCC = 5.5 V VCOM = 0 V or 5.0 V VNO or VNC = 0 V or 5.0 V ICOM_[ON] COM_ On-Leakage Current (Note 5) VCC = 3.6 V VCOM = 0.3 V or 3.3 V VNO or VNC = 0.3 V or 3.3 V VCC = 5.5 V VCOM = 0 V or 5.0 V VNO or VNC = 0 V or 5.0 V 5.5 -2.0 0.01 +2.0 3.6 -2.0 0.01 +2.0 nA 5.5 -1.0 0.01 +1.0 3.6 -1.0 0.01 +1.0 nA 5.5 - 1.36 3.0 - 1.5 W 5.5 3.6 - 0.1 0.4 W 5.0 - 3.5 VCC (V) 3.0 Min - Typ Max 4.5 Unit W
ANALOG SWITCH AC CHARACTERISTICS
-40C to +85C Symbol tON Parameter Turn-On Time Condition VNC_, VNO_ = VIH or VIL RL = 300 W, CL = 35 pF VIN[x] = VIH or VIL tOFF Turn-Off Time VNC_, VNO_ = VIH or VIL RL = 300 W, CL = 35 pF VIN[x] = VIH or VIL tBBM Break-Before-Make Time Delay (Note 5) Skew (Note 5) VNC_, VNO_ = 1.5 V RL = 300 W, CL = 35 pF RS = 39 W, CL = 50 pF - - 0.15 2.0 nS - - 8.0 - nS 1.8 to 5.5 - - 40 nS VCC (V) 1.8 to 5.5 Min - Typ - Max 30 Unit nS
tSKEW 2. 3. 4. 5.
RON characterized for VCC range (1.65 V to 5.5 V). DRON = RON(MAX) - RON(MIN). RFLAT[ON] = RON(MAX) - RON(MIN), measured over VCC range. Guaranteed by design.
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NLAS4717
ANALOG SWITCH APPLICATION CHARACTERISTICS
-40C to +85C Symbol Q Parameter Charge Injection Condition VIN = VCC to GND RIn = 0 W, CL = 1.0 nF Q = CL - DVOUT VISO Off-Isolation f = 10 MHz VNO_, VNC_ = 1.0 Vp-p RL = 50 W, CL = 5.0 pF f = 1.0 MHz VNO_, VNC_ = 1.0 Vp-p RL = 50 W, CL = 5.0 pF VCT Cross-Talk f = 10 MHz VNO_, VNC_ = 1.0 Vp-p RL = 50 W, CL = 5.0 pF f = 1.0 MHz VNO_, VNC_ = 1.0 Vp-p RL = 50 W, CL = 5.0 pF BW On-Channel -3.0 db Bandwidth Total Harmonic Distortion NO_, NC_ OFF-Capacitance NO_, NC_ ON-Capacitance Signal = 0 dB RL = 50 W, CL = 5.0 pF VCOM = 2.0 Vp-p, RL = 600 W, TA = 25C F = 10 MHz F = 10 MHz - - - 0.02 30 110 % pF pF 1.8 to 5.0 40 MHz -53 1.65 to 5.5 -35 dB -110 1.65 to 5.5 -70 dB VCC (V) 3.0 5.0 Min Typ 6.0 9.0 Max Unit pC
THD CNO_[OFF] CNC_[OFF] CNO_[ON] CNC_[ON]
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NLAS4717
2.0 3.0 2.5 2.0 1.5 1.0 0.5 0.5 0.0 0.0 0.0 0.0 +85C +25C -40C
+85C 1.5 RDS(on) (W) RDS(on) (W) 4.0 5.0 +25C 1.0 -40C
1.0
2.0 VCOM (V)
3.0
0.5
1.0
1.5 VCOM (V)
2.0
2.5
3.0
Figure 2. Low RDS(on) @ VCC = 5.0 V
Figure 3. Low RDS(on) @ VCC = 3.0 V
1.5 1.4 1.3 RDS(on) (W) 1.2 1.1 1.0 0.9 0.8 -40C 5.0 V RDS(on) (W)
1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 -40C 3.0 V
+25C TEMPERATURE (C)
+85C
+25C TEMPERATURE (C)
+85C
Figure 4. Delta RDS(on) @ VCC = 5.0 V
Figure 5. Delta RDS(on) @ VCC = 3.0 V
8 6 4 2 Q (cP) 0 -2 -4 -6 -8 -10 0.0 3.0 V 5.0 V THD (%)
1
0.1
3.0 V 0.01 1.0 2.0 VCOM (V) 3.0 4.0 5.0 10 100 1000 FREQUENCY (Hz) 10000 100000
Figure 6. Charge Injection
Figure 7. Total Harmonic Distortion
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NLAS4717
20 0 -20 -40 (dB) -60 -80 -100 -120 -140 0.001 OFF-Isolation -10 VCC = 1.8 V to 5.0 V TA = -55C to +125C 0.1 1 (MHz) 10 100 0.1 1 (MHz) 10 100 Cross-Talk ( (dB) 0 VCC = 1.65 V to 5.5 V Bandwidth -3 dB 5
-5
0.01
Figure 8. Frequency Response
Figure 9. Bandwidth and Phase
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NLAS4717
DUT VCC 0.1 mF 50 W Output VOUT 35 pF 90% Output Input GND tBMM 90% of VOH VCC
Switch Select Pin GND
Figure 10. tBBM (Time Break-Before-Make)
VCC DUT VCC 0.1 mF Open Output VOUT 50 W 35 pF Output VOL Input tON tOFF Input 0V VOH 90% 90% 50% 50%
Figure 11. tON/tOFF
VCC DUT Output Open 50 W VOUT 35 pF Input
VCC 50% 0V VOH Output VOL 10% tOFF tON 10% 50%
Input
Figure 12. tON/tOFF
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NLAS4717
50 W Reference Input Output 50 W Generator 50 W DUT Transmitted
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VOUT for VIN at 100 kHz VIN VONL = On Channel Loss = 20 Log VOUT for VIN at 100 kHz to 50 MHz VIN Bandwidth (BW) = the frequency 3.0 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 W VISO = Off Channel Isolation = 20 Log
Figure 13. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL
DUT Open Output VIN
VCC GND CL Output Off Off DVOUT
VIN
On
Figure 14. Charge Injection: (Q)
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NLAS4717
PACKAGE DIMENSIONS
10 PIN FLIP-CHIP CASE 489AA-01 ISSUE A
4X
D 0.10 C
PIN ONE CORNER
A
B
E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS DIM MIN MAX A --- 0.650 A1 0.210 0.270 A2 0.280 0.380 D 1.965 BSC E 1.465 BSC b 0.250 0.350 e 0.500 BSC D1 1.500 BSC 1.000 BSC E1
A1 0.10 C A2 0.075 C A C
SEATING PLANE
D1 e
10 X
b
C B A 1 2 3 4
0.15 C A B 0.05 C
E1 e
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NLAS4717
PACKAGE DIMENSIONS
Micro10 CASE 846B-03 ISSUE D
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION "A" DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION "B" DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846B-01 OBSOLETE. NEW STANDARD 846B-02 DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.95 1.10 0.20 0.30 0.50 BSC 0.05 0.15 0.10 0.21 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 0.037 0.043 0.008 0.012 0.020 BSC 0.002 0.006 0.004 0.008 0.187 0.199 0.016 0.028
-A-
K
-B-
PIN 1 ID
G
D 8 PL 0.08 (0.003)
M
TB
S
A
S
0.038 (0.0015) -T- SEATING
PLANE
C H J L
SOLDERING FOOTPRINT*
1.04 0.041 0.32 0.0126
10X
10X
3.20 0.126
4.24 0.167
5.28 0.208
8X
0.50 0.0196
SCALE 8:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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NLAS4717/D

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